Method of constructing termination electrodes on yielded semiconductor die by visibly aligning the die pads through a transparent substrate

摘要

A process for fabricating conductive bumps on the bond pads of yielded good die includes forming a transparent structure upon which a masking layer is formed, aligning yielded good die and attaching them to the masking layer, and attaching a backing material to the backside of the die for mechanical support. The transparent structure is then removed and fabrication of the bumps continued on the bond pads of the good die by conventional means.