| 摘要 |
A method of optically detecting a change in intensity of an emission peak in a plasma process, such as a plasma etching process, by reflecting an emission spectrum of radiation from the plasma reaction off of a pair of rugate filters. The reflected emission spectrum has increased in-band reflections and decreased out-of-band reflections which provides reduced noise and an easier-to-detect emission peak. The method can be used for end-point detection in a plasma etching process such as etching of SiO2.
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