| 摘要 |
PURPOSE:To make it possible to connect chip components without strain induced by a thermal cycle by laying out each terminal of a chip component in face- shape and bonding each terminal with a flexible board. CONSTITUTION:There are provide chip components 101, such as an IC, a resistor, a capacitor, and a coil. A sealing resin integrates each chip components 101, and hence forms one piece component 105 having a bump 103 attached to the terminal of each chip component 101. Each terminal of the chip components 101 is integrally laid out in face shape and bonded with a flexible board 106. This construction makes it possible to eliminate thermal strain produced by a thermal cycle and provide a reliable bonding performance and enhance a heat emission performance more satisfactorily if a further attempt is made to integrate the chip components 101, using a good conductor sheet. |
