| 摘要 |
<p>PURPOSE:To manufacture a board for high-frequency circuit with highly accurate plate thickness and low dielectric constant. CONSTITUTION:A plastic-powder sintered porous body is impregnated with heat-hardening resin varnish with heat resistance heat-plastic resin filler, and the obtained dielectric body and metallic foil are laminated to be heated, pressurized, and formed.</p> |
