| 摘要 |
PURPOSE:To obtain a semiconductor device package where bonding inner leads are prevented from being wrongly recognized and lessened in trouble such as bonding deviation by a method wherein at least an inner lead provided with a pattern recognition recess is provided. CONSTITUTION:A lead frame 1 and a window frame 3 are fixed onto a ceramic board 7 through the intermediary of low melting point glass 2, a CCD long chip 4 is fixed on the ceramic board 7, electrodes 8 provided onto the CCD long chip 4 are electrically connected to the tips of inner leads 1b and an inner lead 1c provided with a bonding pattern recognition recess P with metal fine wires 5, and then a cap is fixed through the intermediary of thermosetting resin. In this semiconductor device package, the inner lead 1c provided with a bonding pattern recognition recess P is provided and discriminated from the other inner leads 1b, whereby inner leads are prevented from being wrongly recognized and lessened in defective bonding. |
