发明名称 MICROWAVE OVEN PACKAGE
摘要 18 A laminate structure useful for incorporating into a package structure for the microwave cooking of foodstuffs for consumption comprises an outer layer polymeric material, an outer layer of microwave transparent material, a grid layer having an electroconductive surface surrounding transmissive apertures located between the outer layers, and a thin layer of electroconductive material of sufficient thickness so that a portion of incident microwave energy is converted to thermal energy also located between the outer layers. The structure is useful in providing controlled surface heating and microwave transmittance to achieve a more uniformly heated product employing less structural material than the prior art.
申请公布号 CA2041065(A1) 申请公布日期 1992.08.20
申请号 CA19912041065 申请日期 1991.04.23
申请人 BECKETT INDUSTRIES INC. 发明人 BECKETT, D. GREGORY
分类号 B32B3/10;B32B15/08;B65D81/34;(IPC1-7):H05B6/80;H05B6/64;B32B33/00;B32B31/06;B32B31/12 主分类号 B32B3/10
代理机构 代理人
主权项
地址