| 摘要 |
<p>PURPOSE:To protect semiconductor wafers against fogging by a method wherein guides which enable the semiconductor wafers to be separately provided upright at prescribed intervals are provided to a housing case main body, a lid is provided so as to cover the housing case, and a thermal insulating layer is provided inside the housing case main body and the lid. CONSTITUTION:A housing case main body 1 formed of synthetic resin has a double-wall structure where a thermal insulating layer 2 which is hollow and filled with air is provided. A lid 6 is also formed of synthetic resin and has a double-wall structure where a thermal insulating layer 7 hollow and filled with air is provided. Semiconductor wafers 11 are separately arranged between guides 3 provided to the housing case at a certain interval. In this state, the housing main body 1 is covered with the lid 6, the main body 1 and the lid 6 are fixed together, and the wafers 11 are fixed by wafer pressing pieces 10. By this setup, wafers are protected against fogging when they are transferred, and the housing and the unloading operation of wafers can be easily carried out.</p> |
