| 摘要 |
PURPOSE:To simply perform machining without generating stress due to heat and pressure during the machining process by providing grooves applied with dry etching at least on one nearly flat face of a resin substrate. CONSTITUTION:Grooves are formed at least on one flat face of a resin substrate 2 made of amorphous polyolefin. Resist 3 is coated on the resin substrate 2 made of amorphous polyolefin, and it is exposed to ultraviolet rays (i-ray, g-ray) with a mask 4. The developing process is then performed to reproduce the shape of the mask 4, and the resin substrate 2 is etched by dry etching to the depth about 1-10mum. Resist is removed by ashing and the like to obtain a light wave guide. No stress is generated due to heat and pressure during the machining process of the grooves, and the machining of the grooves is facilitated. |
