| 摘要 |
<p>PURPOSE:To enable a plurality of devices to be capped at a time by mounting a plurality of devices on a mother board which is to be cut into a plurality of boards and then by covering the board with a sealing mother cap which has a plurality of recesses in the bottom and is to be cut into a plurality of caps to seal devices in the respective recess. CONSTITUTION:Top and bottom pattern electrodes 3, 6 and through holes 8 of a mother board 1 are Au-plated, where each device 14 is mounted at the medium position of four through holes 8 and bonded: this device 14 is bonded to a top pattern electrode 3 with wires 15. Thereafter, devices 14 are placed in the respective recesses 10 by covering the the mother board 1 from above the devices 14 with a sealing mother cap 9, thereby hermetically encapsulating the devices 14 in the recesses 10. After sealing is completed, the mother board 1 and the sealing mother cap 9 are cut by a dicing saw into a plurality of chip-type electronic components.</p> |
