| 摘要 |
An apparatus for measuring the temperature of a wafer by a non-contact method includes a supporting device, at a specified position on which the wafer is placed horizontally. A thermocouple is provided with a heat collector at one end thereof. The heat collector is disposed near but in non-contacting relationship with the wafer at the specified position. A reflector capable of reflecting radiant heat is disposed near the heat collector and on the opposite side thereof from the wafer such that radiant heat from the wafer can be efficiently collected by the heat collector.
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