发明名称 REMOVING METHOD FOR COATING FILM FROM ELECTRIC WIRE
摘要 <p>PURPOSE:To peel only an insulating coating with a clear boundary without damaging a core wire by irradiating a part desired to be peeled of a coating of an insulator-coated bonding wire with an excimer laser of 50-200mj/cm<2> of intensity. CONSTITUTION:A part desired to be peeled of an insulating film 2 of an insulator-coated bonding wire 1 is irradiated with an excimer laser. The laser uses a light irradiated when molecules of state of excited molecules generated by polymerizing atoms or molecules of exciting state and atoms or molecules of bottom state are dropped to bottom state, there are various lasers, and ArF, KrF are desirable in view of peelability, safety, output of a device. The intensity of the laser to be irradiated is regulated to 50-200mj/cm<2>. Thus, a clear peeling boundary 4 is formed without damaging a core wire 3, sufficient bonding strength to a base material is obtained, operability at the time of bonding is improved.</p>
申请公布号 JPH04105509(A) 申请公布日期 1992.04.07
申请号 JP19900223079 申请日期 1990.08.24
申请人 SUMITOMO ELECTRIC IND LTD 发明人 HIRAI HIROKI;IWATA KOICHI;NISHIMURA MITSURU
分类号 B21F99/00;H02G1/12 主分类号 B21F99/00
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