| 摘要 |
<p>PURPOSE:To maintain the mechanical strength and the electrical connection satisfactorily while narrowing the wiring pitch of the title tab device by a method wherein a metallic layer is formed of at least exceeding two layers. CONSTITUTION:Metallic wiring layers 1, 3 are two layer structured holding s sheet 2. At this time, a bonding agent may be used for the bonding step of the metallic wiring layers 1, and the insulating layer 2. A chip component 4 such as IC, etc., is connected to a tab device by an electrode 5. In such a multiple laminated layer structure, the strength of the tab device itself can be increased further enabling the metallic wiring width on the insulating sheet 2 to be almost doubled while lowering the electrical resistance together with the increase in the strength. Besides, at the end of the insulating sheet where the stress is apt to be most concentrated on a finger, the root of the finger can be enlarged to avoid the bending of the chip component 4 for enhancing the positional precision. Furthermore, even if any stress is involuntarily impressed on the tab device and the chip component 4 after the connection of the chip component 4, they shall not be broken down.</p> |
