发明名称 MOLD FOR MULTI-LAYER MOLDING
摘要 PURPOSE:To enhance compatible effect and provide sufficient bonding degree by disposing a gate in the almost vertical direction to a surface to be bonded of resin in a cavity. CONSTITUTION:Molten resin injected into a cavity after passing through a runner and a gate 6 hits resin 10 to be bonded which is already contained in the cavity in the almost vertical direction, and the heat and pressure retained by the molten resin are concentrated altogether in the vicinity of the gate of the resin to be bonded to enhance fusion properties in said section and also enhance compatible effect consequently. The gate can be either a pin point gate or a direct gate, and it is effective to provide a plurality of gates to one cavity to increase the degree of bonding.
申请公布号 JPH0494911(A) 申请公布日期 1992.03.27
申请号 JP19900212156 申请日期 1990.08.10
申请人 MURATA MFG CO LTD 发明人 YAMAMOTO KEIZO
分类号 B29C45/16;B29C45/26;B29L9/00 主分类号 B29C45/16
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