发明名称 |
Method of making a light emitting diode array |
摘要 |
In a light emitting diode array, an N-electrode layer (32) is extended from the bottom surface to the top surface of a semiconductor body (30) through the side surface. PN junctions (42) are exposed to the cleavage surface (S) and light is emitted therefrom. Since the N-electrode layer and P-electrode layers (41) are located on a common surface, the LED array can be mounted on a base plate through a soldering process. The LED array can be used without a self-focus lens array in an electric printer for photography.
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申请公布号 |
US5094970(A) |
申请公布日期 |
1992.03.10 |
申请号 |
US19910700422 |
申请日期 |
1991.05.15 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YOSHIDA, SUSUMU;NISHIOKA, TAKAFUMI |
分类号 |
B41J2/45;H01L27/15;H01L33/38 |
主分类号 |
B41J2/45 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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