| 摘要 |
<p>PURPOSE:To sharply enhance an outer lead terminal in brazing strength by a method wherein the outer lead terminal is fitted to a metallized metal layer deposited on the surface of an insulating board through the intermediary of a brazing material of gold which contains a prescribed amount of indium. CONSTITUTION:A metallized metal layer 4 is formed surrounding a recess 1a provided to an insulating board 1, and the electrode of a semiconductor device 3 is electrically connected to the metallized metal layer 4 around the recess 1a through the intermediary of a bonding wire 5, and outer lead terminals 6 formed of metal such as kovar or the like are fitted to the metallized metal layer 4 located at the peripheral part of the insulating board 1 through a brazing material 7. The brazing material 7 is made of alloy of gold and 0.1-15.0% by weight of indium, and the alloy concerned is excellent in wettability to tungsten, molybdenum, or the like contained in the metallized metal layer 4 and kovar contained in the outer lead terminal 6, so that the outer lead terminal 6 can be very firmly brazed to the metallized metal layer 4.</p> |
