发明名称 |
Printed wiring board construction |
摘要 |
A method of fabricating a printed wiring substrate board to have integral contacts over the thickness of a defined connector edge in order to allow for perpendicular mating to exposed conductors on the surface of a second substrate.
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申请公布号 |
US5060369(A) |
申请公布日期 |
1991.10.29 |
申请号 |
US19900473247 |
申请日期 |
1990.01.31 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
DATE, PARSHURAM G. |
分类号 |
H05K3/32;H05K3/36;H05K3/40;H05K3/42 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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