Improvements in or relating to semi-conductor device packaging.

摘要

In a packaging (10) for a semi-conductor device formed on a semi-conductor die (18), a carrier member (11) is formed out of a cylinder of copper to include a rebate (17) and a rounded shoulder (16). One side of the die (18) is fixed in the rebate by solder (19) applied between the die and the rebate bottom. A cap member (12) is arranged to enter the rebate. Cap member (12) includes a base portion (14) to provide a solderable surface. The cap member (12) is soldered to the other side of the die (18) by a soldering (100). The void between the cap member (12) and carrier member (11) are filled with a potting compound.