| 摘要 |
<p>PURPOSE:To improve yield, radiation efficiency and reliability in assembly operation of a resin sealed type semiconductor device and to enable improvement of mounting density and prevention of mounting defects of an electronic device whereon the semiconductor device is mounted by providing specific heat sink and resin sealing part. CONSTITUTION:In a resin sealed type semiconductor device 1, a semiconductor pellet 2 whose external terminal is electrically bonded to an inner lead 4A is sealed by a resin sealing part 8. In the semiconductor device 1, a heat sink 7 whose plane area is larger than a rear side facing an element formation side of the semiconductor pellet 2 is provided to the rear side. A resin sealing part 8 is provided excepting a part of a periphery of the heat sink 7, wherein a front side of the heat sink 7 whereon the semiconductor pellet 2 is mounted covers the semiconductor pellet 2 and has a projecting part 8A, and a rear side facing the front side of the heat sink 7 has a recessed part 8B which is formed to a shape to fit to the projecting part 8A. For example, a plurality of the resin sealed semiconductor devices 1 are stacked in a direction vertical to an element formation side of the semiconductor pellet 2 to constitute an electronic device.</p> |
