发明名称 |
Polyimide resin compositions |
摘要 |
A polyimide resin is prepared by polymerizing (A) a tetracarboxylic acid dianhydride component consisting essentially of 10 to 50 mol % of 2,2-bis(3,4-benzene-dicarboxylic anhydride)perfluoropropane and 90 to 50 mol % of pyromelitic dianhydride or similar acid dianhydride and (B) a diamine component consisting essentially of 10 to 80 mol % of a silicon diamine and 90 to 20 mol % of an ether diamine. The polyimide resin is soluble in ordinary organic solvents to form solutions which are readily applicable to substrates, typically providing insulating protective coatings on electronic parts.
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申请公布号 |
US5041513(A) |
申请公布日期 |
1991.08.20 |
申请号 |
US19900531097 |
申请日期 |
1990.05.31 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
OKINOSHIMA, HIROSHIGE;KATO, HIDETO |
分类号 |
C08G73/10;C08G77/455;C09D5/25;C09D179/08;H01B3/30 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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