| 摘要 |
<p>Where a lead frame (22) or lead structure in a plastic or ceramic-type package (20) is made of a ferromagnetic material (22) an electrically conducting non-ferromagnetic material (22) is added to create a low-inductance path between a semiconductor die (24) and the terminals of the package to reduce self-inductance in the package. To provide an effective low-inductance current path to the ferromagnetic lead frame, the cross-sectional dimensions of the non-ferromagnetic path is preferably no less than 50 microinches. Where the lead frame or lead structure (22) is made from an electrically conducting non-ferromagnetic material (22') a ferromagnetic material (22'') is added to provide strength and rigidity to the lead frame or lead structure. The material added may be plated, spot plated, or cladded onto the starting material. The leads or terminals of a socket (100) may also be constructed in a similar manner to improve its wear-resistance and rigidity while maintaining a low self-inductance.</p> |
