MANUFACTURING METHOD OF HYBRID CIRCUIT DEVICE HAVING THE SAME ELECTRONIC COMPONENT ARRAY AND CIRCUIT MANUFACTURED BY METHOD THEREOF

摘要

PURPOSE: To provide a matrix-like device (array) where electronic functional parts are mounted at high density by providing cut-off means in the area of a part arrangement on a substrate and opening the electric contact where adjacent functional parts or the pattern conductors are electrically connected over the cut-off means. CONSTITUTION: The obstacles 3 with prescribed sections are attached between the pattern conductors 2 on the substrate 1 by an optical chemical method. The material of the obstacles 3 is electrically insulating and it resembles to cured adhesive to mechanical work as much as possible. An LED 4 are sequentially attached to the pattern conductor 3 between the cut-off means. Epoxy resin to which silver is added is used as conductive adhesive 6, for example. The pattern conductor 2 having a resistance value which is too small is electrically connected to the adjacent pattern conductor 2 and only the shorted pattern conductors are detached at the section face 7. Thus, the array whose mounting density is high can be realized and a functional element with defect is removed.