| 摘要 |
PURPOSE:To improve a printed wiring board in wiring containability and to realize the wiring board high in wiring density by a method wherein a through- hole is provided to a laminated board, a multilayered circuit is formed thereon, heat resistant resin is applied onto both the front and the rear of the laminated body and the through-hole is filled with the resin to form an intermediate laminated board, and the intermediate laminated boards are formed into a multilayer printed wiring board interposing a prepreg between them respectively. CONSTITUTION:A divided viahole 3 is provided to a laminated board by through- hole processing, a multilayered circuit is formed, then heat resistant resin paste 4a is applied onto both the front and the rear of the laminated board and the hole 3 is filled is the paste 4a, which is cured by heating to form an intermediate laminated board 5a. Two intermediate laminated boards, the laminated board 5a and another laminated board 5b like the board 5a, are laminated interposing prepreg layers 9a-9c, which is formed into a multilayered board by thermocompression, and a through-viahole 11 and others are provided to the multilayered board concerned, which is improved in viahole effect by the division of through-holes, and thus a multilayer printed wiring board excellent in wiring containability and high in wiring density can be formed. |
