| 摘要 |
<p>PURPOSE:To prevent defective soldering after reflow soldering by making cream solder feeding to mount pad sections on a printed wiring board in linear states and arranging a plurality of solder feeding lines. CONSTITUTION:When leads 3 of an electronic component 2 are mounted on the pad 4 of a printed wiring board, cream solder 5 is fed to the pad 4 in advance. Reflow soldering is performed by arranging the cream solder 5 in a plurality of lines against a pad group. When the solder 5 is arranged, the solder 5 is made to protrude from the pad edge by the half of the pad pitch for the pad parts at both ends of the pad group. As a result, the solder 5 is pulled to the pad sections at both ends by the surface tension when the solder 5 melts and good solder quantities can be secured.</p> |
