发明名称 MULTI-LAYER LEAD FRAMES FOR INTEGRATED CIRCUIT PACKAGES
摘要 <p>A composite lead frame (70) is provided. The lead frame (70) comprises a rigid metal portion (30) electrically interconnected (72) to a flexible multi-layer portion (40). The composite lead frame (70) provides for higher lead densities with better electrical and mechanical properties than achieved with either rigid metal lead frames or flexible leads.</p>
申请公布号 WO1991006978(A2) 申请公布日期 1991.05.16
申请号 US1990005694 申请日期 1990.10.09
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