| 发明名称 |
Device for fastening together under pressure two pieces, one to the other |
| 摘要 |
A heat sink of a circuit package for high density integrated circuits is fastened by a spring element that has shape memory. The fastening is carried out in a manner so that the element can be easily removed for disassembly.
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| 申请公布号 |
US5010949(A) |
申请公布日期 |
1991.04.30 |
| 申请号 |
US19890325763 |
申请日期 |
1989.03.20 |
| 申请人 |
BULL, S.A. |
发明人 |
DEHAINE, GERARD |
| 分类号 |
B23P19/02;F16B1/00;F16B17/00;F16B21/12;H01L23/40;H05K7/20 |
主分类号 |
B23P19/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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