| 摘要 |
<p>PURPOSE:To control the thickness of a resin adhered on a multilayer printed wiring board by using the rough surface side of a copper foil where the surface is roughened as a mold release member inserted between a mold for pressing and making it face to an outer-layer printed wiring board. CONSTITUTION:In the lamination method of a multilayer printed wiring board 3 for performing laminated adhesion by pressing through a resin layer for adhesion 6 between an outer-layer printed wiring board 4 with a through-hole 5 and an inner-layer printed wiring board 7, the rough surface side of a copper foil 10 where the surface is roughened is used facing to the surface of the outer- layer printed wiring board 4 as a release member inserted between a mold 1 for pressing and the outer-layer printed-wiring board 4. Therefore, the surface of a pattern 8 including a throughhole which is formed on the surface of the outer-layer printed wiring board 4 is flat and the copper foil 10 of the release member is formed on a rough surface so that adhesion force is operated on the rough surface side more strongly, thus enabling the resin for adhesion which is pushed out on releasing to be nearly adhered to the rough surface of the release member the thickness of the resin for adhesion which is adhered onto the surface of the outer-layer printed-wiring board 4 to be reduced.</p> |
