| 摘要 |
<p>PURPOSE:To enable the formation of a lead frame for resin-sealed semiconductor device comprising J-leads which prevent the contacting accident among external leads by covering tie bar of the lead frame and a part of external leads with an insulating substance which repels solder. CONSTITUTION:A tie bar 10 of a lead frame and a part of external leads 13 are coated with a solder resist 5 of about 50mum thick. As J-lead type semiconductor devices are manufactured by using this lead frame, the external leads is can be obtained. Namely, the outside of external leads 13 are coated with the solder resist 5. When the J-lead type semiconductor device 8 is mounted on a printed substrate 6, a circumscribed plane 7 of the J-lead type semiconductor device 8 planted vertically from the printed substrate 6 contacts the solder resist 5. Accordingly, even if the adjacent external leads 19 of the J-lead type semiconductor device 8 are in contact to each other, the solder resist 5 as an insulating substance perfectly prevents a short circuit.</p> |
