| 摘要 |
<p>PURPOSE:To improve adhesive properties between a conductive circuit and an insulating resin layer covering the circuit by providing flexibility in the resin layer except the lowermost resin layer, and providing a blackened film between the upper surface of the circuit and the resin layer laminated thereon. CONSTITUTION:When a laminate A in which a metal layer 3 is laminated on an insulating resin layer 2 having flexibility is formed, a flexible sheetlike reinforcing material 19 is superposed on the lower surface side of a semicured insulating resin sheet 6 of the laminate A to be integrated with an insulating resin layer 1, or a blackened layer 5 is provided on a conductive circuit 4a of the laminate A having the sheet 6, a laminate B is superposed on the laminate A, a flexible sheetlike reinforcing material 19 is superposed on the lower surface, and integrally laminated on the layer 1. Thus, adhesive properties between the circuit 4a and an insulating resin layer 8 covering it are improved, and excellent reliability is maintained for repetition of thermal stress due to soldering, etc.</p> |
