<p>A thermally conductive electrically insulative laminate for use as chassis barriers in combination with solid-state electronic devices, the laminate comprising at least three layers and including a pair of outer layers disposed on opposite sides of a center layer. The center layer comprises a film of a polyimide (amide) filled with a quantity of either aluminum oxide or boron nitride particulate solids and included in an amount ranging from between about 10% to about 50% by volume. The outer layers consist essentially of silicone base rubber, and are preferably filled with a quantity of aluminum oxide or boron nitride particulate solids in an amount ranging from between about 25% and 50% by volume.</p>
申请公布号
DE3446047(C2)
申请公布日期
1991.01.24
申请号
DE19843446047
申请日期
1984.12.18
申请人
THE BERGQUIST CO., MINNEAPOLIS, MINN., US
发明人
DEGREE, DAVID C., BURNSVILLE, MINN., US;FICK, HERBERT J.;JUENGER, BRUCE H., NORTHFIELD, MINN., US
