| 摘要 |
PURPOSE:To eliminate warpage even if a film is press-adhered at a high temperature with high temperature softening type adhesive by raising the temperature of a pressing plate of a lead frame side to a value higher by a specific temperature than that of a pressing plate of the film side. CONSTITUTION:A lead frame 2 is ted to a heat block 1 of a pressing plate of a lead frame side, and a film 3 with adhesive temporarily adhered in advance thereto is press-adhered by a pressing plate 4 of a film side. A pressing force is generated by a spring 5. Water cooling holes 6 are provided at the holder 7 of the plate 4, and a heater 8 is provided at the upper side of the holder 7. Here, the temperature of the block 1 is set to a value higher by 100-350 deg.C than that of the plate 4. The softening temperature of the used adhesive is 180 deg.C or higher, and a temperature range capable of adhering is desirably 200 deg.C or higher. The adhesive includes, for example, heat resistant adhesive made of polyetherimide, polyetheramideimide, etc. |
