发明名称 ELECTRONIC PARTS AND ELECTRONIC DEVICE INCORPORATING THE SAME
摘要 An electronic module comprises a board (11) supporting a wiring pattern, semiconductor elements (12) surface mounted on the board, and lead terminals (13) installed at the end of the board. The module is mounted on another board (16) to form an electronic device. Thus, the semiconductor elements can be compactly and densely incorporated into the electronic device because of the surface mounting thereof, and the electronic device can be easily assembled and maintained by using the module. <IMAGE>
申请公布号 GB9023214(D0) 申请公布日期 1990.12.05
申请号 GB19900023214 申请日期 1990.10.25
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人
分类号 H05K1/18;G11C5/00;H01L25/10;H05K1/14;H05K3/34;H05K3/36;H05K7/14 主分类号 H05K1/18
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