发明名称 GOLD ALLOY THIN WIRE FOR BONDING
摘要 PURPOSE:To obtain the gold alloy thin wire for bonding having high fracture strength and heat resistance and having drastically reduced vibration fracture rate by adding specified amounts of Y, Ca and Ag to high purity gold. CONSTITUTION:By weight, 3 to 100ppm Y, 1 to 50ppm Ca as well as 4 to 110ppm Y+Ca and furthermore 5 to 100ppm Ag are added to high purity gold. As the above high purity gold, the one contg. gold of about >=99.99wt.% purity and the balance inevitable impurities is preferably used. The above addition of Y and Ca gives strains to the crystal lattices of gold to increase the recrystallization temp. and to precipitate Y and Ca into the grain boundaries, by which the strength at an ordinary temp. and heat resistance can be improved. Furthermore, the addition of Ag suppresses the precipitation of Y and Ca into the grain boundaries to improve the toughness. In this way, the gold alloy thin wire in which mechanical characteristics at an ordinary temp., loop height, ball shape, etc., are suitably maintainable and having low vibration fracture rate can be obtd.
申请公布号 JPH02259033(A) 申请公布日期 1990.10.19
申请号 JP19890082605 申请日期 1989.03.31
申请人 TATSUTA ELECTRIC WIRE & CABLE CO LTD 发明人 MORI KENJI;TOKITA MASANORI;FUKUDA TAKATOKI;FUJIMOTO EIICHI
分类号 C22C5/02;H01L21/60 主分类号 C22C5/02
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