SEMICONDUCTOR PACKAGE AND CIRCUIT DEVICE MOUNTING SAME,申请号JP19890071351-传众专利搜索

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发明名称	SEMICONDUCTOR PACKAGE AND CIRCUIT DEVICE MOUNTING SAME
摘要
申请公布号	JPH02249260(A)	申请公布日期	1990.10.05
申请号	JP19890071351	申请日期	1989.03.23
申请人	TOSHIBA CORP	发明人	YAMADA HIROSHI;SAITO MASAYUKI;SUDO TOSHIO
分类号	H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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