| 摘要 |
A package having high current feedthroughs comprises: a base comprising a low thermal coefft. of expansion material; a plurality of alternating thermally conductive and electrically conductive rings stacked on the base to define an enclosure. The electrically conductive rings have several internal and external tabs defining high current feed throughs, and the thermally conductive rings provide electrical isolation between the feedthroughs. - Pref. the thermally conductive rings comprise a ceramic e.g. AlN. The package further comprises a seal ring disposed on top of the stacked rings, sealed to a lid. The rings are pref. brazed together and the package is plated with Ni and Au, thus defining a hollow enclosure for microelectronics. |
