| 摘要 |
A co-fired hybrid circuit includes silver internal connections, such as vias (1,4) and patterns (3), and gold-based external connections (6). A diffusion barrier (9 min ), for example of palladium-silver, covers a via (4) which extends towards an external surface of an outermost layer (5) of a stack of ceramic sheets (2, 5). The diffusion barrier (9 min ) can be screen printed onto layer (5) following formation of the via (4) and prior to lamination, burn out and firing of the stack. The gold external connections are applied subsequently to firing. |
