| 摘要 |
PURPOSE: To surely protect a conductor path in a succeeding etching process by completely removing a first etching resist layer before a second etching resist layer is formed after etching off the exposed area of a metallic layer to the surface of a substrate. CONSTITUTION: A metallic layer 4 and a first etching resist layer 5 are successively formed on a substrate 1 having a through hole 2 and the area 6 of the resist layer 5 which is directly adjacent to a pattern which becomes a conductor path is removed with electromagnetic radiation S. Then the exposed area of the metallic layer 4 is etched off to the surface of the substrate 1 and a second metallic etching resist layer 7 is formed on the remaining part of the metallic layer 4. After the formation of the resist layer 7, the area 8 of the resist layer 5 which does not correspond to a conductor pattern is connected to an anode and the etching resist in the area 8 connected to the anode is completely removed by electrolysis. Then the exposed area of the metallic layer 4 exposed when the resist is removed is completely etched off to the surface of the substrate 1. |
