首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Method for producing a honeycomb body, especially a catalyst carrier body having sheet metal layers twisted in opposite directions
摘要
申请公布号
US4923109(A)
申请公布日期
1990.05.08
申请号
US19890322772
申请日期
1989.03.13
申请人
INTERATOM GMBH
发明人
CYRON, THEODOR
分类号
B01D53/86;B01J35/04;F01N3/28;F01N13/04
主分类号
B01D53/86
代理机构
代理人
主权项
地址
您可能感兴趣的专利
氮化物半导体结构及半导体发光元件;NITRIDE SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR LIGHT-EMITTING ELEMENT
磊晶晶圆、半导体发光元件、发光装置及磊晶晶圆之制造方法;EPITAXIAL WAFER, SEMICONDUCTOR LIGHT EMISSION ELEMENT, LIGHT EMISSION DEVICE AND MANUFACTURING METHOD OF EPITAXIAL WAFER
半导体装置、其制造方法及电子装置;SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
接面场效电晶体;JUNCTION FIELD EFFECT TRANSISTOR
交叉点记忆体及其制造方法;CROSS-POINT MEMORY AND METHODS FOR FABRICATION OF SAME
触控装置及其制造方法;TOUCH-SENSITIVE DEVICE AND PRODUCTION METHOD THEREOF
半导体装置及其制造方法;SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
薄膜覆晶封装结构及其可挠性线路载板;CHIP-ON-FILM PACKAGE STRUCTURE AND FLEXIBLE CIRCUIT BOARD THEREOF
减少记忆体临界电压偏移的方法;METHOD OF DECREASING THRESHOLD VOLTAGE SHIFT OF MEMORY
半导体线宽特征及其制造方法;SEMICONDUCTOR LINE FEATURE AND MANUFACTURING METHOD THEREOF
胶带贴附装置及胶带贴附方法;TAPE STICKING APPARATUS AND TAPE STICKING METHOD
印刷电路板,具有其之半导体封装及制造其之方法;PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE HAVING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
基板处理方法及基板处理装置;SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
晶圆抛光方法
半导体装置用基板、半导体装置用基板之制造方法及固体摄像装置
保护元件及电池组;PROTECTION DEVICE AND BATTERY PACK
电容器结构及其制造方法;CAPACITOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
显示器及其子画素驱动方法;DISPLAY AND SUB-PIXEL DRIVING METHOD THEREOF
有机发光二极体显示器之像素驱动电路及其操作方法;PIXEL DRIVING CIRCUIT FOR ORGANIC LIGHT EMITTING DIODE DISPLAY AND OPERATING METHOD THEREOF
像素驱动电路;PIXEL DRIVING CIRCUIT