发明名称 |
Circuit substrate and producing method of the same |
摘要 |
A circuit substrate comprises a sintered oxide body of barium, tin and boron as an insulating body which is able to be fired at a temperature less than 1300 DEG C. The circuit substrate is further improved in moisture resistance by containing titanium or securing substantially the composition of BaSn(BO3)2.
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申请公布号 |
US4916261(A) |
申请公布日期 |
1990.04.10 |
申请号 |
US19840648304 |
申请日期 |
1984.09.07 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
THANH, TRUONG D.;IWASE, NOBUO |
分类号 |
C04B35/01;H05K1/03 |
主分类号 |
C04B35/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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