首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
LEAD FRAME FOR RESIN SEALED TYPE SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH0296360(A)
申请公布日期
1990.04.09
申请号
JP19880249262
申请日期
1988.10.03
申请人
MATSUSHITA ELECTRON CORP
发明人
SANO AKIRA
分类号
H01L23/50
主分类号
H01L23/50
代理机构
代理人
主权项
地址
您可能感兴趣的专利
LENS DEVICE
ALIGNMENT LAYER FORMING DEVICE, ALIGNMENT LAYER FORMING METHOD, DRAWING DEVICE AND DRAWING METHOD
ANALOG SIGNAL PROCESSING CIRCUIT, SIGNAL PROCESSING CIRCUIT, PHOTODETECTION DEVICE, AND IMAGE FORMING DEVICE
OPTICAL DEVICE AND IMAGING SYSTEM
IMAGE HEATING DEVICE
DISPLAY APPARATUS
THREE-DIMENSIONAL ULTRASONIC IMAGING APPARATUS
SURVEY AIRPLANE
SOLDER CONNECTION INSPECTION DEVICE
POLYMERIC MATERIAL EVALUATION METHOD, AND ACCELERATED DETERIORATION TEST DEVICE
BOLOMETER TYPE INFRARED DETECTOR, AND METHOD OF REDUCING AFTERIMAGE
SURVEYING APPARATUS
INSPECTION METHOD
INSTRUMENT AND METHOD FOR MEASURING SEMICONDUCTOR DEVICE
INTEGRATED DISPLAY SYSTEM IN SONOBUOY SIGNAL PROCESSING APPARATUS
ULTRASONIC WAVE RECEIVER, AND MEASURING SYSTEM
ULTRASOUND FLOWMETER
BEARING DEVICE WITH ROTATION SENSOR
ILLUMINATION OPTICAL DEVICE
UNDERWATER TESTER
