| 摘要 |
PURPOSE:To prevent short circuit and misregistration of bonding and to prevent unnecessary contact due to bonding wire by positioning a thick film print insulating pattern to prevent contact of a bonding wire between a thick film print pad and its adjoining pad. CONSTITUTION:A bare chip 2 is mounted on an insulating substrate 1. A thick film printed board for a bare chip is provided with a thick film print pad 4 which is connected to the substrate 1 through wire bonding. In this thick film printed board, a thick film print insulating pattern 6 is located between the thick film print pad 4 and its adjoining pad 4 to prevent contact of a bonding wire 5. For example, the bare chip 2 is mounted on the insulating substrate 1, and when a plurality of bonding pad 4 at the side of the insulating substrate 1 are arranged before an electric connection circuit is formed to the bonding pad 4 at the side of the insulating substrate 1 from a bonding pad 3 at the bare chip side by using the bonding wire 5, an insulating dam 6 is provided between the bonding pads 4 by using insulating thick film print paste. |
