| 摘要 |
<p>PURPOSE:To eliminate a need to mount a bypass capacitor and to reduce a production cost by a method wherein the bypass capacitor is built inside a semiconductor memory device. CONSTITUTION:A semiconductor memory device where a bypass capacitor 1 is inserted between a power-supply terminal 2 and a ground terminal 3 is sealed in a container 6 identical to that of a semiconductor chip 6. That is to say, the bypass capacitor 1 is connected to a suspension pin 4 connected to an island 5 (which is connected to the ground terminal 3) where the semiconductor chip 6 has been loaded and to an inner lead 21 (which is connected to the power supply terminal 2) adjacent to it; these are sealed in the container 7. Since the container is much larger as compared with the semiconductor chip, in many cases there is sufficient room to mount a small-sized capacitor.</p> |
