PACKAGE STRUCTURE

摘要

PURPOSE: To provide a small sealing structure whose manufacturing cost us low by sealing a space between the peripheral part of an electronic device fitted on a substrate and the substrate with flip flop structure by means of specified resin. CONSTITUTION: Pins 30 are provided on one surface 24 of the substrate 12 of ceramic and the like and contact pads 26 are provided on the other surface 20. Both faces are conencted by a conductive pattern 18. Contact pads 10 formed on the surface 6 of the IC chip 4 are connected with the pads of the substrate 12 by solder mounts 28. The back 14 and the side 48 and the substrate surface 20 at the periphery of the chip are covered by resin 44 and the chip 4 and the connection parts are protected from external environment. Resin 44 has characters that ion density is not more than about 50ppm, it wettability is satisfactory and bridge connection density at the time of hardening is high. Resin does not substantially contain solvent and epoxy resin of Dexter Hisol Company is used, for example.