| 摘要 |
PURPOSE:To attenuate an electromagnetic noise generated from an electronic device to the degree not to become a problem in practice without an EMI filter and a shielding case by adding a shielding function to a package itself of an integrated circuit. CONSTITUTION:In an electronic device using a digital signal, electromagnetic wave failure removing means is provided at the package itself of a semiconductor integrated circuit used in the device. For example, a whole DIP is molded with a conductive molding material 42, and the material 42, a lead terminal 41, leads and the integrated circuit are insulated thereamong by an insulating film 43. The material 42 is brought into contact with a tab securing lead, which is connected to a GND. Thus, an electromagnetic wave noise can be attenuated to the degree not to become a problem in practice without an EMI filter and a shielding case. As a result, its component cost is reduced, the mounting efficiency of a board is improved, its assembling cost is decreased, and the device can be further reduced in size and weight. |
