首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
MULTI-PIN FLAT MOLDING SEMICONDUCTOR PACKAGE
摘要
申请公布号
JPH01202852(A)
申请公布日期
1989.08.15
申请号
JP19880028001
申请日期
1988.02.08
申请人
NEC CORP
发明人
OTSUKI YUJIRO
分类号
H01L23/50;H05K1/14;H05K3/34
主分类号
H01L23/50
代理机构
代理人
主权项
地址
您可能感兴趣的专利
STORAGE CONTROL DEVICE, CONTROL PROGRAM, AND CONTROL METHOD
KARAOKE CONTRIBUTION SYSTEM, KARAOKE DEVICE, AND COMPOSITE MOTION PICTURE CREATION METHOD
EAVES GUTTER RECEIVER
DRIVE MODE SWITCHING CIRCUIT OF MOTOR, DRIVE CONTROLLER OF MOTOR, AND DRIVE CONTROL METHOD OF MOTOR
ROTARY ELECTRIC MACHINE
IMAGE READER, DOCUMENT FEEDER AND IMAGE FORMATION APPARATUS
CONTENT RECORDING/REPRODUCING DEVICE
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
VEHICULAR LIGHTING FIXTURE
ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE AND ELECTRONIC APPARATUS USING THE SAME, AND METHOD FOR MANUFACTURING ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE
OBJECT RECOGNITION DEVICE, OBJECT RECOGNITION PROGRAM USED FOR OBJECT RECOGNITION DEVICE, AND MOVING BODY CONTROL SYSTEM
VEHICLE POSITION RECOGNITION SYSTEM
POP LABEL
METAL FITTING FOR RETAINING PANEL
SCRATCH LABEL
METHOD FOR BONDING RADIATION SHIELDING MATERIAL
REFRIGERANT DISTRIBUTOR
PIPE JOINT STRUCTURE
