| 摘要 |
<p>PURPOSE:To enhance the sealing effect with a metal cap and to improve the reliability of a semiconductor device, by covering a resin for sealing a semiconductor element with a metal cap, and providing a bonding and reinforcing part for enhancing adhesion with the resin on the bonding surface of the metal cap. CONSTITUTION:A metal cap 11 is molded in a shallow pan shape by the drawing of an aluminum plate having a thickness of 0.1-0.5mm. Almite treatment is applied on the surface of the cap 11. The rear surface of part of the metal cap 11 is coated with a bonding and reinforcing material 10 comprising epoxy silane, monosilane and the like to a thickness of 10-50mum. A semiconductor element 22 is mounted on a package substrate 21 having a semiconductor- element mounting part and a wire bonding part. After wire bonding 23 is performed, they are sealed with a sealing resin 24 such as epoxy resin and silicone resin. A bonding resin such as epoxy resin and silicone resin is further applied on the upper surface of the sealing resin 24. The resin 25 is covered with the metal cap 11, and its rear surface side is bonded.</p> |
