| 摘要 |
PURPOSE:To restrict position deviation of an element carrier and to prevent the positional deviation between the outer electrodes of the element carrier and the wirings on a circuit board, by providing a means which forcibly determines the position of the circuit board. CONSTITUTION:A semiconductor chip 2 is mounted on the upper surface of a rectangular parallelopiped element carrier body 1. Outer electrodes 5 and projection 8 are provided on the lower surface. Wiring patterns 6 are formed at positions which can be connected to the outer electrodes 5 are formed on a circuit board 7. A hole 9 is formed in the circuit board 7. The size of the hole 9 is determined so that the projection 8 is coupled into the hole. The accuracy of the fixing position of the element carrier body 1 can be controlled with the degree of coupling. When a plurality of the projections and the holes or recess parts are provided, the position alignment can be performed accurately furthermore. |
