| 摘要 |
PURPOSE:To enable applying a constant contact bonding load without the influence of change of sinking amount due to the irregularity of the height of parts to be bonded, by installing a linear motor set to energizing a capillary toward the semiconductor mounting side. CONSTITUTION:The subject equipment is provided with a capillary 7, ascending and descending means 16-18 for capillary, detecting means 23, 24 for bonding surface contact, and a linear motor 12. The capillary 7, into which a wire 3 is inserted, bonds the wire 3 to a part to be bonded. The ascending and descending means 16-18 make the capillary 7 ascend and descend between a bonding position and a ascending position to form a ball at a wire tip. The detecting means 28, 24 detect the contact between the capillary 7 and a bonding surface. The linear motor 12 is installed to energize the capillary 7 toward the semiconductor mounting side. The linear motor 12, e.g., maintain the rocking of a supersonic wave horn 8 maintaining the capillary 7. Thereby obtaining an arbitrary contact bonding load, and enabling the applying of a constant contact bonding load without being influenced by the irregularity of the height of parts to be bonded. |
