CHIP POSITION DETECTING EQUIPMENT AND CHIP FEEDING METHOD IN DIE-BONDER,申请号JP19870297456-传众专利搜索

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发明名称	CHIP POSITION DETECTING EQUIPMENT AND CHIP FEEDING METHOD IN DIE-BONDER
摘要
申请公布号	JPH01140633(A)	申请公布日期	1989.06.01
申请号	JP19870297456	申请日期	1987.11.27
申请人	TOKYO SOKUHAN KK	发明人	TERAJIMA HIROSHI
分类号	G01B11/00;H01L21/52;H01L21/66	主分类号	G01B11/00
代理机构		代理人
主权项
地址

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