| 摘要 |
PURPOSE: To improve the electrostatic withstanding pressure by mounting a triple film structure comprising a first insulating film, a conductive film and a second insulating film between a printed board and a metallic case. CONSTITUTION: The insulating films 14, the conductive films 13 and the insulating films 12 are respectively stacked on both faces of a printed board 13 on which a power source or a grand wiring 104, a resistor 103 and an exclusive electrode 102 are formed, further a plurality of ICs 17 are loaded, and a connector 16 is mounted, and they are stored in a metallic case 11. The both conductive films 13 are connected with the exclusive electrode 102 of the printed board 15 by the conductive materials 101 through the through holes. Accordingly the discharged current is converted into the heat energy by the resistor to be absorbed, when the static electricity is gradually charged in the metallic case 11, and the discharging is generated between the conductive film 13 and the metallic case. Further the discharging by the conductive film 13 and the printed board 15 can be prevented by the resistor 103. Whereby the electrostatic withstanding pressure can be improved. |
