| 摘要 |
PURPOSE:To prevent the short circuit between a conductive adhesive and a wire junction pad by a method wherein an insulator is interposed between a die junction pad and the wire junction pad by surrouding the die junction pad. CONSTITUTION:Between the die junction pad 2a and the wire junction pad 2b, the insulator 6 such as glass or polyimide resin is formed higher than the pad 2a by surrounding the pad 2a. Thereby, the short circuit between the pad 2b caan be preveted by the outflow of the adhesive 3 to the directon of the pad 2b. The use of a porous insulator of poor wetting property for the insulator 6 is also effective. This constitution eanbles to prevent the short circuit and facilitates high density mounting. |
